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TQM8555![]() TQ-Minimodule with Freescale PowerPC MPC 8555, up to 512 MB SDRAM, up to 128 MB Flash, 100 x 75 mm² Equipped with the MPC8540, MPC8555 and MPC8560 PowerQUICC controllers, the TQM 85xx TQ modules are built for high-performance industrial applications. The CPU performance of up to 833 MHz represents the high end of PowerPC-supported systems. The superior CPU performance is supplemented by a very high memory bandwidth attained by the DDR SDRAM (dual data rate synchronous DRAM) connected with a 64 bit data bus width. With up to 512 Mbytes, the main memory offers sufficient space for even the most demanding applications. |
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A sufficient amount of hard disk space is available from two flash banks and up to 128 MB memory. Developers can connect additional flash memory via the external system bus. In the PowerQUICC line, the PowerQUICCIII is the most complex processor of all with a wide variety of leading-edge functions and interfaces. The PowerQUICCIII has approximately 2000 registers which places special demands on processor initialization. By using the TQM85xx modules, the user simplifies and accelerates application tasks. The PowerQuicc processors by Freescale are distinguished by excellent communication performance. The TQM85xx module series takes full advantage of this strength: Every processor interface is available for communication. Of particular note are the Rapid I/O™ interfaces (500 MHz, 8-bit LVDS), 2 Gbit Ethernet interfaces, and the PCI / PCI-X interface. In addition to these high-speed interfaces, there is a series of proven communication paths that can be used to connect slower peripherals and for system management tasks: two RS232 interfaces and an I²C bus. Despite the extremely compact dimensions, the module accepts up to two external CAN controllers. In addition, the user has up to three FCC, two SCC and one JTAG interfaces at his disposal. To allow developers to realize high-computation applications within minimum space, TQ Components optimized the TQM85xx modules to fit areas up to 70 x 75 mm². Components were required with the smallest package size. The layout used the smallest possible structures. The microvia technique was used due to the complex processor housing with a 783 pin FC BGA package. |
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